Abstract:

Improved heat management methods for electrically driven devices are essential to maintain operating effectiveness, reliability, and durability. With power densities rising in contemporary electronics, good thermal management is a key design issue. Traditional cooling techniques tend to fail as a result of disparate heat distribution, scalability limitations, and poor real-time thermal monitoring. These issues cause overheating, performance loss, and hardware failure. To effectively heat dissipasion in high-performance computer systems, the suggested approach combines thermal imaging with computational fluid dynamics (TI-CFD) analysis, thereby addressing these problems. Best cooling comes from real-time heat mapping from thermal imaging, optimal airflow patterns and material placements from CFD models. This combined approach lets one optimize heat sink topologies, assess compactly packed circuit system thermal performance, and enable precise hotspot locations. Maintaining maximum temperature profiles even at full operation obviously reduces thermal stress and provides better system stability. Convergence of simulation and imaging produces an adaptive, scalable, and more efficient heat controlling solution for state-of- the-art electronic devices. The proposed method achieves the thermal stress by 34.5%, system stability by 98.7% and adaptability by 97.6%.