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ABSTRACT LIBRARY

Exploring the Electromagnetic Characteristics of Polyimide/TiO2 Hybrid Films and Their Interface-Dependent Behavior

Publisher: IEEE

Authors: P Dhivaa, Hindusthan College

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Abstract:

The electromagnetic characteristics of the Polyimide/TiO2 hybrid films multifunctional nano-composites including Thermoplastic Polyimides, are considerarably critical for the development of advanced aerospace insulation systems. They tend to be evaluated as a dielectric material, which is a key aspect influencing the functionality and dependability of aerospace systems. Executing simple dielectric tests poses challenges related to narrow access to low frequencies and lack of sensitivity to important interfacial effects which are central to understanding actual behavior of materials during operating conditions. Such a deficiency in test method stunts the characterization of the hybrid film's potential as an aerospace insulation material. The proposed method applies Broadband Dielectric Spectroscopy (BDS), which has the ability to perform dielectric measurements over a wide range of frequencies, thereby assessing low and high frequency. Enhanced sensitivity of BDS to dielectric response allows for more precise evaluation of interface interactions between Polyimide and TiO2, which is essential for more efficient performance of these materials. The findings confirm that Polyimide/TiO2 hybrid films possess better dielectric properties at elevated frequencies which improves their insulation performance and empowers advanced aerospace system applications. These results outline directions for furthering insulation material research for aerospace applications. These results are relevant to materials design and advanced aerospace system performance optimization

Keywords: Polyimide, TiO2, Hybrid Films, Dielectric Performance, Broadband Dielectric, Insulation Materials, Dielectric Spectroscopy, Aerospace Applications.

Published in: 2024 Asian Conference on Communication and Networks (ASIANComNet)

Date of Publication: --

DOI: -

Publisher: IEEE