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Introduction

2026 International Conference on Networks Computers and Communications (ICNCCom 2026) is aimed to serve as an international forum to provide a unique platform to the fellow academic community, industry experts, practitioners, researchers, and developers working in the field Networks, Computer Science, Artificial Intelligence and Wireless communications,  for exchanging knowledge, experience, and findings by demonstrating new results and present emerging directions in the ICNCCom 2026. The theme of the conference is ' RAIN-Reliable AI-enabled Networks’ for advancing humanity. 

The academic partner for this conference is Kongunadu College of Engineering and Technology, and technical co-sponsor is the IEEE. All accepted and presented papers that strictly satisfy the quality norms of the IEEE will be included in the conference proceedings, sent to the IEEE for inclusion in the IEEE Xplore, and indexed in EI and Scopus. This conference's first edition will focus on a gamut of topics that include Cyber Security, Computer Vision and Pattern Recognition, Internet of Things, 5G and beyond Wireless Networks, Network Slicing, Quantum Communications, and Artificial Intelligence use cases in  Computers, Mobile, Wireless networks, Health Care and Precision Agriculture.

The United Societies of Science (Abbr.: USS, from now on referred to as USS) The USS is a cross-border community for scientists and researchers with openness, equality, and inclusion. It was established in 2023, and registered in Hong Kong and is a borderless, non-profit, non-governmental organization. It aims to promote the integrated development of global scientific research and human well-being by facilitating the exchange and sharing of knowledge and cross-border collaboration. For USS, "science" mainly refers to science, technology, engineering, medicine, management, and social sciences. USS believes that humanities and arts also belong to the category of "science" and are of great significance to human development.

Committee

Patrons

Chairman

PSK. R. Periaswamy, Kongunadu Institutions, India

Secretary

Kongan K Thangavelu, Kongunadu Institutions, India

Treasurer

PST. V. S, Thennarasu, Kongunadu Institutions, India

Vice-Chairman

PSK. P. Arunkumar, Kongunadu Institutions, India

Joint Secretary

P. Ashokkumar, Kongunadu Institutions, India

Committee

General Chairs

R. Asokan, Kongunadu College of Engineering and Technology, India

J. Yogapriya, Kongunadu College of Engineering and Technology, India

J. Preetha, Kongunadu College of Engineering and Technology, India

Chairs

K. Amutha, Kongunadu College of Engineering and Technology, India

Vitawat Sittakul, IEEE Member, King Mongkut's University of Technology North Bangkok, Thailand

Organizing Chair

M. Dharmalingam, Kongunadu College of Engineering and Technology, India

TPC Chairs

R. Kishore, Sri Sivasubramaniya Nadar College of Engineering, India

Iacovos Ioannou, University of Cyprus, Cyprus

Norul Ashikin Norzain, MAHSA University, Malaysia

Finance Chair

Shaoxiong Wang, United Societies of Science, Hong Kong (China)

Publicity Chairs

Shaoxiong Wang, United Societies of Science, Hong Kong (China) (Committee Chair)

Minella BEZHA, Doshisha University, Japan

Publication Chairs

Nagarajan P, United Societies of Science, Hong Kong (China)

R SATHYA, Kongunadu College of Engineering and Technology, India

Students Outreach Committee

Michalis Savva, University of Cyprus, Cyprus

M.Karthikeyan, Kongunadu College of Engineering and Technology, India

International Advisory Committee

Tor Morten Groenli, Kristiania University of Applied Sciences, Norway

Hanisah Binti Mohd Zali, MAHSA University, Malaysia

Kishore R, Sri Sivasubramaniya Nadar College of Engineering, India

Dejan Vukobratovic, University of Novi Sad, Novi Sad, Serbia

Ali Hashim Abbas, Imam Ja'afar Al-Sadiq University, Iraq

Wolfgang Gerstacker, Friedrich-Alexander-University Erlangen-Nuremberg, Germany

Idayachandran .G, VIT, Chennai

Andreas Pitsillides, University of Johannesburg, South Africa

Tolga M. Duman, Bilkent University, Turkey

Josep Miquel Jornet, Northeastern University, USA

Soon-Xin NG, University of Southampton, UK

Minella BEZHA, Doshisha University, Japan

Wai Yie Leong, INTI International University, Malaysia

M.D. Selvaraj, IIITDM Kancheepuram, India

Nakkeeran R, Pondicherry University, India

Iacovos Ioannou, University of Cyprus, Cyprus

Vitawat Sittakul, King Mongkut's University of Technology, North Bangkok, Thailand

Suvendi Rimer, University of Johannesburg, South Africa

Abdourahime GAYE, Université Alioune Diop, Senegal

Aldeniz Rashidov, Technical University of Gabrovo, Bulgaria

Tariq Ahamad Ahanger, Prince Sattam bin Abdulaziz University, Saudi Arabia

Pelin ANGIN, Middle East Technical University, Turkey

Santi Prasad Maity, IIEST, India

Ala' Khalifeh, German Jordanian University, Jordon

Rajesh A, SASTRA University, India

Jayalakshmi, Pondicherry University, India

Technical Co-Sponsorship Committee, IEEE Madras Section

Chairman         P. Sakthivel

Secretary         S. Radha

Treasurer         S. Brindha

Call for paper

Important Dates

2026-05-31
Draft paper submission deadline

2026 International Conference on Networks Computers and Communications (ICNCCom 2026) is aimed to serve as an international forum to provide a unique platform to the fellow academic community, industry experts, practitioners, researchers, and developers working in the field Networks, Computer Science, Artificial Intelligence and Wireless communications,  for exchanging knowledge, experience, and findings by demonstrating new results and present emerging directions in the ICNCCom 2026. The theme of the conference is ' RAIN-Reliable AI-enabled Networks’ for advancing humanity. 

 

The academic partner for this conference is Kongunadu College of Engineering and Technology, and technical co-sponsor is the IEEE. All accepted and presented papers that strictly satisfy the quality norms of the IEEE will be included in the conference proceedings, sent to the IEEE for inclusion in the IEEE Xplore, and indexed in EI and Scopus. This conference's first edition will focus on a gamut of topics that include Cyber Security, Computer Vision and Pattern Recognition, Internet of Things, 5G and beyond Wireless Networks, Network Slicing, Quantum Communications, and Artificial Intelligence use cases in  Computers, Mobile, Wireless networks, Health Care and Precision Agriculture.

Submission topics

The papers are invited for the following tracks:

Track 1: 5G and beyond Wireless Networks

Track 2: Internet of Things

Track 3: Network Slicing

Track 4: Cyber Security

Track 5: Computer Vision and Pattern Recognition

Track 6: Quantum Communications

Track 7: Artificial Intelligence Use Cases

Track 8: Disruptive Technologies for Manufacturing

AuThor guidelines

During the initial paper submission process via the Aconf submission system, it is the authors' responsibility to ensure that the author list and paper title in the submitted PDF file match exactly the author list and paper title on the  Aconf submission system registration page. 

 

IMPORTANT: The page length limit for all initial submissions for review is SIX (6) printed pages (10-point font) and must be written in English. Initial submissions longer than SIX (7) pages will be rejected without review.

 

All final submissions of accepted papers must be written in English with a maximum paper length of six (6) printed pages (10-point font), including figures. No more than two (2) additional printed pages (10-point font) may be included in final submissions, and the extra pages (the 7th and 8th pages) will incur an over-length page charge of USD 10 for each page.  Please refer to the acceptance letter for the instructions on how to upload final papers.
 

Download Standard IEEE conference templates for LaTeX formats >>
Download Standard IEEE conference templates for Word >>

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Important Dates
  • Conference date

    07-30

    2026

    -

    08-01

    2026

  • 05-31 2026

    Draft paper submission deadline

  • 07-05 2026

    Early Bird Registration

  • 07-05 2026

    Registration deadline

Sponsored By

The United Societies of Science

Organized By

Kongunadu College of Engineering and Technology

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